How does Apple dissipate heat?

How Apple dissipates heat: Revealing the heat dissipation technology of iPhone and MacBook

With the arrival of high temperatures in summer, the heat dissipation problem of electronic devices has once again become the focus of users' attention. As the world's leading technology company, Apple's thermal design of its iPhones and MacBooks has always been controversial. This article will combine the hot topics and hot content on the Internet in the past 10 days, conduct an in-depth analysis of the heat dissipation technology of Apple devices, and present relevant data in a structured way.

1. iPhone heat dissipation design

The heat dissipation of iPhone mainly relies on passive heat dissipation technology, including metal middle frame, graphene heat sink and internal thermal conductive glue. The following are statistics on iPhone cooling issues reported by users in the past 10 days:

2. MacBook cooling technology

MacBook uses an active cooling design, equipped with fans and heat pipes. The following is a comparison of MacBook cooling performance that has been hotly discussed in the past 10 days:

3. The direction of improvement of Apple’s heat dissipation technology

According to technology media reports in the past 10 days, Apple may improve heat dissipation technology in the following aspects:

1.iPhone 16 series: May introduce VC vapor chamber technology for the first time to improve heat dissipation efficiency.

2.MacBook: New heat dissipation materials are being tested and are expected to be used in 2025 models.

3.Software optimization: iOS 18 and macOS 15 will improve the temperature control algorithm and reduce performance fluctuations.

4. How users can improve the heat dissipation of Apple devices

Based on user discussions in the past 10 days, the following practical suggestions are summarized:

5. Expert opinions

Technology blogger @TechInsider pointed out in a recent video: "Apple has always taken a balanced approach to heat dissipation design, ensuring that the device is thin and light while ensuring stable performance. The improved energy efficiency of the M series chips has significantly improved heat dissipation issues, but there is still room for improvement in high-performance scenarios."

6. Future Outlook

According to industry analyst predictions, Apple may launch cooling technology upgrades at the following points:

The heat dissipation issue of Apple devices has always been the focus of users. With technological advancement and the accumulation of user feedback, I believe Apple will continue to improve the heat dissipation performance of its devices while maintaining design aesthetics.